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Confidential Document
DATA IMAGE
CORPORATION
LCD Module Specification
ITEM NO.: CM16022ASFAYA-03
Table of Contents 1. COVER & CONTENTS 2. RECORD OF REVISION 3. GENERAL SPECIFICATIONS 4. ABSOLUTE MAXIMUM RATINGS 5. ELECTRICAL CHARACTERISTICS 6. ELECTRO-OPTICAL CHARACTERISTIC 7. TIMING CHARACTERISTICS 8. PIN CONNECTIONS 9. POWER SUPPLY 10. BLOCK DIAGRAM 11. QUALITY ASSURANCE 12. LOT NUMBERING SYSTEM 13. LCM NUMBERING SYSTEM 14. PRECAUTIONS IN USE LCM 15. OUTLINE DRAWING 16. PACKAGE INFORMATION R&D Dept. Q.C. Dept. Eng. Dept. 1 2 3 4 6 6 9 11 11 12 19 23 23 24 25 26 Prod. Dept.
Version:
Issued Date: 2002/8/13
Sheet Code:
Total Pages: 26
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2.
Rev B C D
RECORD OF REVISION
Date APR/17/00 OCT/13/00 13/AUG/02 13/AUG/02 Item 15 15
11.2.3, 11.3
Page 24 25
21-22
Comment 1.Change LED PAD Dimension from 5mm to
7mm
Change: Dimension tolerance from 71.3(0)(-0.2) to 71.3(0.3).
1.Change: 11.2.3 Inspection Parameters. 2.Add:11.3 Sampling Condition. Change: P/N from CM1625S1LY-J3 to CM16022ASFAYA-03.
13
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3.
GENERAL
SPECIFICATION
16characters (W) x 2.95 (W) x 62.2 (W) x 80 (W) x 40 g max. STN Gray Reflective Transmissive V STN Yellow V Transflective Negative 12 O'clock EL Amber Others Others CCFL Blue Green FSTN 2lines (H) 5.55 (H) 17.9 (H) mm mm
Display Format : Character Size : View Area : General Dimensions : Weight : LCD Type : Polarizer mode :
36 (H) x 14.5 (T) mm Max.
View Angle : Backlight : Backlight Color :
V 6 O'clock V LED V Yellow green White
Controller / Driver : Temperature Range :
KS0066U V Normal Operating 0 to 50C Storage -20 to 70C Wide Temperature Operating -20 to 70C Storage -30 to 80C
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4. ABSOLUTE MAXIMUM RATINGS 4.1 ELECTRICAL ABSOLUTE MAXIMUM RATINGS
VSS= 0V,
Item Supply Voltage (Logic) Supply Voltage (LCD Driver) Input Voltage Operating Temperature Storage Temperature Symbol VDD-VSS VDD-Vo VI TOP TSTG Min. 0 1.5 VSS 0 -20 Max. 7 13.5 VDD 50 70
Ta = 25C
Unit V V V
C C
4.2
Item
ENVIRONMENTAL ABSOLUTE MAXIMUM RATINGS
Operating (Min.) 0 Note (2) --4.9M/S
2 2
Storage (Min.) -20 Note(2) --19.6M/S 490M/S
2 2
Max.) 50
(Max.) 70
Comment Note (1) Without Condensation XYZ Direction XYZ Direction
Ambient Temp Humidity Vibration Shock
29.4M/S
Note(1) Ta = 0C : 50Hr Max. Note(2) Ta 40C : 90% RH Max. Ta 40C : Absolute humidity must be lower than the humidity of 90% at 40C.
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4.3 Electronic Static Discharge maximum rating
ESD test method : IEC1000-4-2 Item Testing environment Testing equipment Testing condition Direct discharge Indirect discharge Pass condition Fail condition Description Ambient temperature :15C to 35 C Humidity: 30% to 60 % LCM ( E.U.T ) : Power up Manufacture: NoiseKen, Model No. ESD-100L See drawing 1 0 to 6 KV Discharge point, see drawing 2 0 to 12KV Discharge point, see drawing 1 No malfunction of unit. Temporary malfunction of unit which can be recovered by system reset Non. Recoverable malfunction of LCM or system
F IG 1 E S D T E S T IN G E Q U IP M E N T
D IR E C T D IS C H A R G E H C P IN D IR E C T D IS C H A R G E V C P IN D IR E C T D IS C H A R G E
HCP
IS O L A T O R
ESD PO W ER SU PPLY 470k GROUND LEVEL
W O O D E N T A B L E (T A L L 0 .8 m )
(1)
DIRECT CONTACT DISCHARGE
CONTACT POINT : A.B.C.D
C D
A B
(2)
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5.
Item
ELECTRICAL CHARACTERISTICS
Symbol VDD-VSS 0C VDD-V0 VIH VIL IDD VDD-VSS=5V 25C 50C -Condition Min. 2.7 4.3 4.2 3.6 0.7VDD VSS -Typ. 5.0 4.7 4.5 3.9 --2.0 Max. 5.5 5.0 4.8 4.3 VDD 0.3VDD -V mA V Unit V
Supply Voltage (Logic) Supply Voltage (LCD) Input Voltage Logic Supply Current
6. ELECTRO-OPTICAL CHARACTERISTICS
ITEM Rise Time Fall Time Contrast View Angle Frame Frequency Symbol Tr Tf CR 1~2 1, 2 Ff Condition 0C 25C 0C 25C 25C 25C & CR3 25C 30 30 -Min. --Typ. 300 70 900 200 3 --64 ---Hz Max. 450 105 1350 300 Unit ms Note (1) ms Note (3) Note (2) Ref.
Note (1) & (2) : See next page Note (3) : Contrast ration is defined under the following condition: CR= Brightness of non-selected condition Brightness of selected condition ( a ). ( b ). ( c ). ( d ). Temperature ---------- 25C Frame frequency ---- 64Hz Viewing angle -------- = 0, = 0 Operating voltage --- 4.5V
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Note (1) Response time is measured as the shortest period of time possible between the change in state of an LCD segment as demonstrated below: +Vop 1/f F 0
-Vop 90% 100% 10% tr Condition: ( a ) . Temperature ---------------25C ( b ) . Frame frequency --------- 64Hz ( c ) . View Angle ----------------- = 0, =0 ( d ) . Operating voltage -------- 4.5V Note (2) Definition of View Angle Top - Bottom direction Top 1 2 Right -- Left direction 2 1 tf
Bottom
Left
Right
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6.1
Item
Forward Voltage
LED ELECTRO-OPTICAL CHARACTERISTIC
Symbol
VF IV P IR
Condition
IF =200mA Yellow Green IF = 200mA Yellow Green IF = 200mA Yellow Green IF = 200mA Yellow Green VR = 8V Yellow Green
Min.
------
Typ.
4.2 160 573 30 --
Max.
4.6 -575 -0.2
Ta = 25C Unit
V cd/m2 nm nm mA
Luminous Intensity Peak Emission Spectrum Radiation Reverse Current
Note : Measured at the bared LED backlight unit.
6.2 LED MAXIMUM OPERATING RANGE
Item
Power Dissipation Forward Current Reverse Voltage
Symbol
PAD IAF VR
Yellow Green
0.85 300 8
Unit
W mA V
6.2.1
LED ARRAY BLOCK DIAGRAM
A
2 Dies X 12 =24
K
6.2.2
LED POWER SOURCE
Option A LED B C Nil GND Power source VDD/VSS 15K/16A A/K 15A/16K BZL GND FRM GND Jumper setting J1,J3,R9 J2,J5,J7 NONE J2,J4,J6 J8 J9 Mark
V
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7. TIMING CHARACTERISTICS 7.1 WRITE TIMING
AC characteristics (VDD=4.5v~5.5v,Ta=-30~85C)
Item E cycle time E pulse width (high level) E rise/fall time R/W and RS Setup time R/W and RS Hold time Data setup time Data hold time Symbol tc tw tR, tF tsu1 tH1 tsu2 tH2 Condition Min. 500 230 -40 10 80 10 Max. --20 ----Unit
VDD = 5V
ns
AC characteristics (VDD=2.7v~4.5v,Ta=-30~85C)
Item E cycle time E pulse width (high level) E rise/fall time R/W and RS Setup time R/W and RS Hold time Data setup time Data hold time Symbol tc tw tR, tF tsu1 tH1 tsu2 tH2 Condition Min. 1000 450 -60 20 195 10 Max. --25 ----Unit
VDD = 3V
ns
VIH1 RS VIL1 tSu1 R/W VIL1 tW VIL1 E DB0 to DB7 VIH1 tf VIH1 tsu2 VIH1 Valid data VIL1 tC t h1
VIH1 VIL1 th1 VIL1
tf VIL1 VIL1 th2 VIH1 VIL1
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7.2 READ TIMING
AC characteristics (VDD=4.5v~5.5v,Ta=-30~85C)
Item E cycle time E pulse width (high level) E rise/fall time R/W and RS shetup time R/W and RS hold time Data output delay time Data hold time Symbol tc tw tR, tF tsu tH tD tDH Condition Min. 500 230 -40 10 -5 Max. --20 --120 -Unit
VDD = 5V
ns
Item
E cycle time E pulse width (high level) E rise/fall time R/W and RS setup time R/W and RS hold time Data output delay time Data hold time
AC characteristics (VDD=2.7v~4.5v,Ta=-30~85C) Symbol Condition Min. Max. Unit tc 1000 -tw 450 -tR, tF -25 tsu VDD = 3V ns 60 -tH 20 -tD 360 tDH 5 --
VIH1 RS VIL1 tSU R/W VIH1 VIH1 VIL1 tR tD DB0 To DB7 VIH1 Valid data VIL1 tc tw VIH1 tDH
VIH1 VIL1 tH VIH1 tH tF
E
VIL1 tH VIH1 VIL1
VIL1
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8.
PIN CONNECTIONS
No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Symbol VSS VDD V0 RS R/W E DB0 DB1 DB2 DB3 DB4 DB5 DB6 DB7 LED A LED K Function Ground, 0V Logic power supply, +5V Voltage for LCD drive Data / Instruction register select Read / Write Enable signal, start data read/write
Data Bus Line
LED Anode, power supply + LED Cathode, ground 0V
9.
POWER SUPPLY
VDD +5V VSS
VR
V0
+5 V
LED A LED K VR = 10K
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10. BLOCK DIAGRAM
VSS VDD V0 RS R/W E DB0 DB7 Com 16
LCD 16 characters x 2 line
Control LSI
Seg 40 Seg 40
LCD Driver
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10.1 INSTRUCTIONS
Instruction Clear Display Instruction Code
RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 0 0 0 0 0 0 0 0 0 1
DESCRIPTION Write "20H" to DDRAM and set DDRAM address to "00H " from AC Set DDRAM address to "00H" from AC and return cursor to its original Position if shifted. The contents of DDRAM are not changed. Assign cursor moving direction and enable the shift of entire display. Set display (D), cursor(C), and Blinking of cursor(B) ON/OFF control bit. Set cursor moving and display shifts cursor bit, and the direction, without changing of DDRAM data. Sets interface data length (DL:8-BIT/4-BIT), number of display lines(N:2-line/1-line) and, display font type (F:5x11dots/5x8 dots). Set CGRAM address in address counter. Set DDRAM address in address counter. Whether during internal operation or not can be known by reading BF. The contents of address counter can also be read. Write data into internal RAM (DDRAM / CGRAM) Reads data from internal RAM (DDRAM / CGRAM).
Executed Time( fosc =270KHz)
1.53mS
Cursor At Home
0
0
0
0
0
0
0
0
1
-
1.53mS
Entry Mode Set Display On/Off Control Cursor or Display Shift Function Set Set CGRAM Address Set DDRAM Address Read Busy Flag and Address Write Data to RAM Read Data from RAM *"-":don't care
0
0
0
0
0
0
0
1
I/D
SH
39S 39S 39S
0
0
0
0
0
0
1
D
C
B
0
0
0
0
0
1
S/C R/L
-
-
0
0
0
0
1
DL
N
F
-
-
39S 39S 39S 0S 43S 43S
0 0
0 0
0 1
1
AC5 AC4 AC3 AC2 AC1 AC0
AC6 AC5 AC4 AC3 AC2 AC1 AC0
0
1
BF AC6 AC5 AC4 AC3 AC2 AC1 AC0
1 1
0 1
D7 D7
D6 D6
D5 D5
D4 D4
D3 D3
D2 D2
D1 D1
D0 D0
NOTE : When an MPU program with checking the Busy Flag(DB7) is made, it must be necessary 1/2Fosc is necessary for executing the next instruction by the falling edge of the `E' signal after the Busy Flag(DB7)goes to "LOW" .
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10.2 8-Bit Operation,8-Digitx2-Line Display Example
Step No 1 2 3 4 Instruction RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Power supply on (the IC is initialized by the Internal reset circuit) Function set 0 0 0 0 1 Display on/off control 0 0 0 0 0 Entry mode set 0 0 0 0 0 1 0 0 1 1 0 0 1 1 1 1
_
Display
Operation
Initialized. No display. Sets to 8-bit operation and selects 2-line display and 5x8 dot character font. Turns on display and cursor. All display is in space mode because of initialization. Sets mode to increment the address by one and to shift the cursor to the right at the time of write to the DD/CGRAM. Display is not shifted. Writes H. DDRAM has already been selected by initialization when the power was turned on. The cursor is incremented by one and shifted to the right
0
_
0
H_
5
Write data to CGRAM/DDRAM 1 0 0 1 0 0 1
.
0
0
0
.
6 7 8 9 10 11 12 13 14 15 Return home 0 0 0
Write data to CGRAM/DDRAM 1 0 0 1 0 0 1 Set DDRAM address 0 0 1 1 0 0 0 Write data to CGRAM/DDRAM 1 0 0 1 0 0 1
.
HITACHI_
Writes I. Sets DDRAM address so that t The cursor is positioned at the Head of the second lime. Writes M.
0 0 1
0 0 0
1 0 1
HITACHI _
HITACHI M_
.
Write data to CGRAM/DDRAM 1 0 0 1 0 0 1 Entry mode set 0 0 0 0 0 0 0 Write data to CGRAM/DDRAM 1 0 0 1 0 0 1
.
1 1 1
1 1 0
1 1 1
HITACHI MICROCO_ HITACHI MICROCO_ ITACHI ICROCOM_
.
Writes O.
Sets mode to shift display at the time of write. Writes M. Display is shifted to the left. The first and second lines both shift at the same time.
HITACHI
0
0
0
0
0
1
0
MICROCOM
Returns both display and cursor to the original position (address 0).
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10.3 Interfacing to the MPU
The IC can send data in either two 4-bit operations, thus allowing interfacing with 4or 8-bit MPUs.
*
For 4-bit interface data, only four bus lines (DB4 to DB7) are used for transfer. Bus lines DB0 to DB3 are disabled. The data transfer between the IC and the MPU is completed after the 4-bit data has been transferred twice. As for the order of data transfer, the four high order bits (for 8-bit operation,DB4 to DB7) are transferred before the four low order bits (for 8-bit operation, DB0 to DB3). The busy flag must be checked (one instruction) after the 4-bit data has been transferred twice. Two more 4-bit operations then transfer the busy flag and address counter data.
RS R/W E
DB7 DB6 DB5 DB4 IR7 IR6 IR5 IR4 IR3 IR2 IR1 IR0 BF AC6 AC5 AC4 AC3 AC2 AC1 AC0 DR7 DR6 DR5 DR4 DR3 DR2 DR1 DR0
Instruction register (IR) write
Busy flag (BF) and Address counter (AC) read
Data register (DR) read
4-Bit Transfer Example
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10.4
Display position DDRAM
Address (hexadecimal) 1
1-Line Display
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
00 01 02 03 04 05 06 07 40 41 42 43 44 45 46 47 16x1-Line
2-Line Display
Display position DDRAM
Address (hexadecimal) 1 2 3 4 5
8 16 20 24
39
40
00 40
01 41
02 42
03 43
04 44
26 66
27 67
8x2-Line 16x2-Line 20x2-Line 24x2-Line
4-Line Display
Display position DDRAM
Address (hexadecimal) 1 2 3
15
16
00 40 14 54
01 41 15 55
02 42 16 56
0E 4E 1E 5E 16x4 Line
0F 4F 1F 5F
Display position DDRAM
Address (hexadecimal)
1
2
3

19
20
00 40 14 54
01 41 15 55
02 42 16 56
12 52 26 66
13 53 27 67
20x4 Line
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10.5
CGRAM
Relationship between CGRAM Addresses, Character Codes (DDRAM) and Patterns (CGRAM Data)
For 5x8 dot character patterns
Character Codes (DDRAM data) 76543210 High Low CGRAM Address 5 4 3 2 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 1 Low 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 Character Patterns (CGRAM data) 76543210 High 1 1 1 1 1 1 1 0 1 0 1 0 1 0 0 0 1 0 0 1 0 0 0 0 0 1 1 0 1 0 0 0 Low 1 0 0 1 1 0 0 0 0 0 1 1 1 1 1 0 1 0 0 1 0 1 0 0 0 1 1 0 1 0 0 0 0 1 1 Character 0 Pattern (1) 0 0 1 0 } Cursor position 1 0 1 Character 0 Pattern (2) 1 0 0 0 } Cursor position
High
0000000
0
0
0
0000001
0
0
1
0000111
1
1
1 1 1 1 1 0 0 1 1 0 1 0 1
Notes : 1. Character code bits 0 to 2 correspond to CGRAM address bits 3 to 5 (3 bits: 8 types). 2. CGRAM address bits 0 to 2 designate the character pattern line position. The 8th line is the cursor position and its display is formed by a logical OR with the cursor. Maintain the 8th line data, corresponding to the cursor display position, at 0 as the cursor display. If the 8th line data is 1, 1 bits will light up the 8th line regardless of the cursor presence. 3. Character pattern row positions correspond to CGRAM data bits 0 to 4 (bit 4 being at the left). 4. As shown Table 5, CGRAM character patterns are selected when character code bits 4 to 7 are all 0. However, since character code bit 3 has no effect, the R display example above can be selected by either character code 00H or 08H. 5. 1 for CGRAM data corresponds to display selection and 0 to non-selection. Indicates no effect.
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10.6 Correspondence between Character Codes and Character Patterns (ROM Code:A00)
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11.
QUALITY ASSURANCE 11.1 Test Condition
11.1.1 Temperature and Humidity(Ambient Temperature) Temperature : 20 5C Humidity : 65 5% 11.1.2 Operation Unless specified otherwise, test will be conducted under function state. 11.1.3 Container Unless specified otherwise, vibration test will be conducted to the product itself without putting it in a container. 11.1.4 Test Frequency In case of related to deterioration such as shock test. It will be conducted only once. 11.1.5 Test Method
No. 1 2 3 4 5 6 7
Parameter High Temperature Operating Low Temperature Operating High Temperature Storage Low Temperature Storage Vibration Test (Non-operation state) Damp Proof Test (Non-operation state) Shock Test (Non-operation state)
Conditions 50 2 C 0 2 C 70 2 C -20 2 C Total fixed amplitude : 1.5mm Vibration Frequency : 10 ~ 55Hz One cycle 60 seconds to 3 directions of X.Y.Z. for each 15 minutes 40C 2C, 90~95%RH, 96h
Regulations Note 3 Note 3 Note 3 Note 3 Note 3
Note 1,2 Note 3
To be measured after dropping from 60cm high once concrete surface in packing state Note 1: Returned under normal temperature and humidity for 4 hrs. Note 2: No dew condensation to be observed. Note 3: No change on display and in operation under the test condition
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11.2 Inspection condition
11.2.1 Inspection conditions The LCD shall be inspected under 40W white fluorescent light.
45
11.2.2 Definition of applicable Zones
B LCD A BEZEL PCB
A : Display Area B : Non-Display Area
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11.2.3 Inspection Parameters
No. Parameter Black or White spots Zone Dimension D < 0.15 0.15 D< 0.2 0.2 D 0.25 D 0.3 Acceptable Class number Of Defects A B 4 4 Minor 2 2 0 1 D = (Long + Short) / 2 AQL Level Criteria
1
2.5 * : Disregard
2
Scratch,
Substances Class Acceptable Of number X (mm) Y(mm) Defects A B 0.04 W 4 4 3.0 L 0.06 W Minor 2 3 2.0 L 0.08 W 0 1 0.1 < W X : Length Y : Width : Disregard Total defects should not exceed 4/module Zone AQL Level
2.5
3
Air Bubbles (between glass & polarizer) Zone Dimension D 0.15 0.15 < D 0.25 Acceptable number A B 2 Class of Defects Minor AQL Level
2.5
0 1 0.25 < D : Disregard Total defects shall not excess 3/module.
4
Uniformity of Pixel
(1)
Pixel shape (with Dent) 0.152
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(2)
Pixel shape ( with Projection)
Should not be connected to next pixel 0.152 (3) Pin hole X
4
Uniformity of Pixel
Y ( X + Y )/2 0.02mm (Less than 0.1 mm is no counted) (4) Deformation
X ( X + Y ) / 2 0.3mm
Y Total acceptable number : 1/pixel, 5/cell Definition It is a defect that is likely to result in failure or to reduce materially the usability of the product for the intended function. It is a defect that is likely to assembly size and not result in functioning problem. It is a defect that will not result in functioning problem with deviation classified.
Major Class of defects Minor
AQL 0.65% AQL 1.00% AQL 2.5%
11.3 Sampling Condition
Unless otherwise agree in written, the sampling inspection shall be applied to the incoming inspection of customer. Lot size: Quantity of shipment lot per model. Sampling type: normal inspection, single sampling Inspection level: Level II Sampling table: MIL-STD-105E
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12.
LOT NUMBERING SYSTEM
9 7 4 2 Production week number Production year
13. LCM NUMBERING SYSTEM CM 16022A S F A Y A - 03
Version:03 View direction & Temp. Range A-Bottom view 6H & Normal temp. B-Bottom view 6H & Wide temp. C-Top View & Normal temp. D-Top View & Wide temp.
Backlight Color
B -Blue W -White Y - Yellow
Backlight
S -edge light LED B/L E -EL A -Array LED B/L
MODE
M - transmissive F - transflective R - Reflective N - Negative
LCD type
P - FSTN Paper white F - FSTN S - STN Yellow G -STN Gray
Series code 16022A-16 characters X 2 lines; 2 LCD Type, A PCB Type Model type
CM - Character Module GM - Graphic Module TG -Single TAB Graphic Module TX-Custom Single TAB Graphic Module
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14.
PRECAUTION FOR USING LCM
(5) The normal static prevention measures should be observed for work clothes and working benches; for the latter conductive (rubber) mat is recommended. (6). Since dry air is inductive to statics, a relative humidity of 50-60% is recommended. 2.3 Soldering (1). Solder only to the I/O terminals. (2). Use only soldering irons with proper grounding and no leakage. (3). Soldering temperature : 280C 10C (4). Soldering time: 3 to 4 sec. (5). Use eutectic solder with resin flux fill. (6). If flux is used, the LCD surface should be covered to avoid flux spatters. Flux residue should be removed after wards. 2.4 Operation (1). The viewing angle can be adjusted by varying the LCD driving voltage V0. (2). Driving voltage should be kept within specified range; excess voltage shortens display life. (3). Response time increases with decrease in temperature. (4). Display may turn black or dark blue at temperatures above its operational range; this is (however not pressing on the viewing area) may cause the segments to appear "fractured". (5). Mechanical disturbance during operation (such as pressing on the viewing area) may cause the segments to appear "fractured". 2.5 Storage If any fluid leaks out of a damaged glass cell, wash off any human part that comes into contact with soap and water. Never swallow the fluid. The toxicity is extremely low but caution should be exercised at all the time. 2.6 Limited Warranty Unless otherwise agreed between DATA IMAGE and customer, DATA IMAGE will replace or repair any of its LCD and LCM which is found to be defective electrically and visually when inspected in accordance with DATA IMAGE acceptance standards, for a period on one year from date of shipment. Confirmation of such date shall be based on freight documents. The warranty liability of DATA IMAGE is limited to repair and/or replacement on the terms set forth above. DATA IMAGE will not responsible for any subsequent or consequential events.
1. LIQUID CRYSTAL DISPLAY (LCD) LCD is made up of glass, organic sealant, organic fluid, and polymer based polarizers. The following precautions should be taken when handing, (1). Keep the temperature within range of use and storage. Excessive temperature and humidity could cause polarization degredation, polarizer peel off or bubble. (2). Do not contact the exposed polarizers with anything harder than an HB pencil lead. To clean dust off the display surface, wipe gently with cotton, chamois or other soft material soaked in petroleum benzin. (3). Wipe off saliva or water drops immediately. Contact with water over a long period of time may cause polarizer deformation or color fading, while an active LCD with water condensation on its surface will cause corrosion of ITO electrodes. (4). Glass can be easily chipped or cracked from rough handling, especially at corners and edges. (5). Do not drive LCD with DC voltage. 2. Liquid Crystal Display Modules 2.1 Mechanical Considerations LCM are assembled and adjusted with a high degree of precision. Avoid excessive shocks and do not make any alterations or modifications. The following should be noted. (1). Do not tamper in any way with the tabs on the metal frame. (2). Do not modify the PCB by drilling extra holes, changing its outline, moving its components or modifying its pattern. (3). Do not touch the elastomer connector, especially insert an backlight panel (for example, EL). (4). When mounting a LCM make sure that the PCB is not under any stress such as bending or twisting . Elastomer contacts are very delicate and missing pixels could result from slight dislocation of any of the elements. (5). Avoid pressing on the metal bezel, otherwise the elastomer connector could be deformed and lose contact, resulting in missing pixels. 2.2. Static Electricity LCM contains CMOS LSI's and the same precaution for such devices should apply, namely (1). The operator should be grounded whenever he/she comes into contact with the module. Never touch any of the conductive parts such as the LSI pads, the copper leads on the PCB and the interface terminals with any parts of the human body. (2). The modules should be kept in antistatic bags or other containers resistant to static for storage. (3). Only properly grounded soldering irons should be used. (4). If an electric screwdriver is used, it should be well grounded and shielded from commutator sparks.
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15. OUTLINE DRAWING
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16.PACKAGE INFORMATION
Anti-static bag
LCM
Carton
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